№ EP4674921A1発明
審査中ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
ADHESIVE COMPOSITION, ADHESIVE TAPE, METHOD FOR PROCESSING SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
❖Sekisui Chemical Co., Ltd.ZHANG, Ye; UEDA, Kozo; OGATA, Yudai; TAKIJIRI, AyaJan 6, 2026C09J, C09J, C09J +325