CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD
CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD
A cylindrical grinding apparatus produces a monocrystal for slicing by cylindrical grinding an outer circumferential surface of a monocrystal for grinding while rotating the monocrystal for grinding around a rotation axis. The cylindrical grinding apparatus includes: an attitude correcting section for correcting an attitude of the monocrystal for grinding to incline a center axis thereof with respect to the rotation axis, by rotating the monocrystal for grinding around the center axis and turning the monocrystal for grinding around a turn axis orthogonal to the center axis based on a plane orientation difference between a plane orientation of the monocrystal for grinding and a target plane orientation of a wafer to be obtained by slicing the monocrystal for slicing; and a grinding section for cylindrically grinding the outer circumferential surface of the monocrystal for grinding while rotating the monocrystal for grinding whose attitude has been corrected around the rotation axis.