№ US20260005417A1発明
審査中DESIGN AND STRUCTURES OF HIGH-SPEED INTERCONNECTS FOR IMPROVED SIGNAL INTEGRITY
DESIGN AND STRUCTURES OF HIGH-SPEED INTERCONNECTS FOR IMPROVED SIGNAL INTEGRITY
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.
❖University of South CarolinaGuoan Wang; Yingcong Zhang§ 2/20 請求項H1P 3/8, H1P 5/18, H1P 11/ +121