№ US20260002060A1発明
審査中TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
Provided herein is a two-component thermally-conductive epoxy adhesive.
❖DDP SPECIALTY ELECTRONIC MATERIALS US, LLCFelix KOCH; Beda STEINER§ 1/15 請求項C9J 163/, C9J 9/, C9J 11/6 +120