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案件記録

Solder Supply Method

発明審査中
2閲覧数
19請求項 · 1 独立
§ Ⅰ

案件概要

発明者

Kota Sugisawa; Takahiro Matsufuji; Shunsaku Yoshikawa

IPC分類

B23K 35/26B23K 1/8B23K 35/30

CPC分類

B23K35/262B23K1/8B23K35/264B23K35/3006

A solder supplying method for maintaining the Bi content contained in a solder alloy in a solder bath at a predetermined amount even after soldering a large number of printed circuit boards with a Bi-containing solder alloy. A solder supplying method includes supplying an additionally supplied solder, which is Sn and/or a low-Bi solder alloy having a lower Bi content than a Bi-containing solder alloy, to a solder bath into which the Bi-containing solder alloy has been introduced, thereby adjusting the Bi content in the solder bath to the Bi content of the Bi-containing solder alloy when it has been initially introduced in the solder bath.

原文(中国語)

A solder supplying method for maintaining the Bi content contained in a solder alloy in a solder bath at a predetermined amount even after soldering a large number of printed circuit boards with a Bi-containing solder alloy. A solder supplying method includes supplying an additionally supplied solder, which is Sn and/or a low-Bi solder alloy having a lower Bi content than a Bi-containing solder alloy, to a solder bath into which the Bi-containing solder alloy has been introduced, thereby adjusting the Bi content in the solder bath to the Bi content of the Bi-containing solder alloy when it has been initially introduced in the solder bath.

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