SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, POLISHING APPARATUS, AND POLISHING METHOD

原文（中国語）

A substrate polishing apparatus is a substrate polishing apparatus configured to perform polishing processing on a processing surface of a substrate and includes: a grinding module in which a first grinding member and a second grinding member with a maximum diameter larger than a maximum diameter of the first grinding member are disposed; a polishing module including a polishing member; and a control device configured to control the grinding module and the polishing module, and the control device controls the grinding module to perform first grinding on part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member and controls the polishing module to perform polishing on the processing surface on which the first grinding and the second grinding have been performed.