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案件記録

DIAMETER-WIRE DICING MACHINE

発明審査中
6請求項 · 1 独立
§ Ⅰ

案件概要

IPC分類

B26D 1/547B26D 1/B26D 7/1

CPC分類

B26D1/547B26D1/6B26D7/18B26D2001/13B26D2001/2

A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.

原文(中国語)

A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.

外部リソース