THERMOPLASTIC COMPOSITION FOR LASER DIRECT STRUCTURING

原文（中国語）

A thermoplastic composition having an aromatic polycarbonate and a copper chromite spinel laser direct structuring additive. The composition includes a) 85-95 wt. % of an aromatic polycarbonate; b) 2-15 wt. % of a copper chromite spinel laser direct structuring additive, c) 0.05-5 wt. % of a flame retardant, which is a flame retardant salt or organic flame retardant, d) 0.1-2 wt. % of an acid-modified polymer, and e) optionally 0-5 wt. % of a siloxane based rubber. A molded part having the composition, a process for producing a circuit carrier with the molded part, and to a circuit carrier obtainable by the process.