POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, LAMINATE, ELECTRONIC DEVICE, METHOD OF PRODUCING LAMINATE, METHOD OF PRODUCING POLYIMIDE FILM, AND METHOD OF PRODUCING ELECTRONIC DEVICE
案件概要
発明者
Hirofumi Nakayama; Masayoshi Kido; Nobuaki Tanaka
IPC分類
CPC分類
A polyimide precursor composition contains a polyimide precursor and an organic solvent. The polyimide precursor has a structural unit into which a specific xanthene structure has been introduced. The imidization ratio of the polyimide precursor is 10 mol % or more and 100 mol % or less. The organic solvent may be one or more solvents selected from N-methyl-2-pyrrolidone, 1-butyl-2-pyrrolidone, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, N,N-dimethylpropionamide, N,N-diethylformamide and 1,3-dimethyl-2-imidazolidinone.
原文(中国語)
A polyimide precursor composition contains a polyimide precursor and an organic solvent. The polyimide precursor has a structural unit into which a specific xanthene structure has been introduced. The imidization ratio of the polyimide precursor is 10 mol % or more and 100 mol % or less. The organic solvent may be one or more solvents selected from N-methyl-2-pyrrolidone, 1-butyl-2-pyrrolidone, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, N,N-dimethylpropionamide, N,N-diethylformamide and 1,3-dimethyl-2-imidazolidinone.
外部リソース