RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD
案件概要
出願人
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
発明者
Hajime OGUSHI; Hayate HIRONO; Takatoshi MITO; Koichi ISAJI; Hiroyuki FUJISAWA
IPC分類
CPC分類
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a polyphenylene ether compound (a1) having at least one of a hydroxyl group and a carboxyl group in a molecule and a carbodiimide compound (a2), and a reactive compound (B) having an unsaturated double bond in a molecule.
原文（中国語）
A resin composition contains a preliminary reaction product (A) obtained by previously reacting a mixture containing a polyphenylene ether compound (a1) having at least one of a hydroxyl group and a carboxyl group in a molecule and a carbodiimide compound (a2), and a reactive compound (B) having an unsaturated double bond in a molecule.
外部リソース