HYBRID MOISTURE-PROOF LAYER AND METHOD OF MANUFACTURING SAME
案件概要
出願人
KOREA ELECTRONICS TECHNOLOGY INSTITUTE
発明者
Soon Hyung KWON
IPC分類
CPC分類
Disclosed are a hybrid moisture-proof layer including a base film, a first moisture-proof layer formed by curing a first solution on the base film, a second moisture-proof layer formed by curing a second solution on the first moisture-proof layer, a mixed layer formed between the first moisture-proof layer and the second moisture-proof layer, and a third moisture-proof layer formed using a deposition process on the second moisture-proof layer, and a method of manufacturing the same.
原文(中国語)
Disclosed are a hybrid moisture-proof layer including a base film, a first moisture-proof layer formed by curing a first solution on the base film, a second moisture-proof layer formed by curing a second solution on the first moisture-proof layer, a mixed layer formed between the first moisture-proof layer and the second moisture-proof layer, and a third moisture-proof layer formed using a deposition process on the second moisture-proof layer, and a method of manufacturing the same.
外部リソース