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案件記録

Functionalized Metal and Nitride CMP Slurry

発明審査中
10請求項 · 1 独立
§ Ⅰ

案件概要

発明者

Yi GUO; Arthur W. MARTIN

IPC分類

C9G 1/2

CPC分類

C9G1/2

The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates. The polishing solution includes a solvent; functionalized carbon-based particles having oxygen-containing functional groups a silica abrasive; a Fenton's catalyst or reagent and a corrosion inhibitor. The functionalized carbon-based particles have oxygen-containing functional groups that react with a peroxy moiety to increase oxygen to carbon atomic ratio on the functionalized carbon-based particles. The functionalized carbon-based particles contain at least 10 weight percent of an sp3-containing structure, the functionalized carbon-based particles include at least 0.01 atomic percent oxygen and a surface of the functionalized carbon-based particles has an atomic oxygen to carbon ratio of at least 0.01.

原文(中国語)

The invention provides a chemical mechanical polishing solution for metal and metal nitride substrates. The polishing solution includes a solvent; functionalized carbon-based particles having oxygen-containing functional groups a silica abrasive; a Fenton's catalyst or reagent and a corrosion inhibitor. The functionalized carbon-based particles have oxygen-containing functional groups that react with a peroxy moiety to increase oxygen to carbon atomic ratio on the functionalized carbon-based particles. The functionalized carbon-based particles contain at least 10 weight percent of an sp3-containing structure, the functionalized carbon-based particles include at least 0.01 atomic percent oxygen and a surface of the functionalized carbon-based particles has an atomic oxygen to carbon ratio of at least 0.01.

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