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案件記録

ELECTROCONDUCTIVE COMPOSITION, ELECTROCONDUCTIVE ADHESIVE, AND CURED PRODUCT

発明審査中
1閲覧数
11請求項 · 1 独立
§ Ⅰ

案件概要

発明者

Takashi SUZUKI; Satoru ENDO

IPC分類

C9J 9/2C8G 59/32C8G 59/38C8G 59/40C8G 59/50C8G 59/68C8K 7/6C9J 11/4C9J 163/

CPC分類

C9J9/2C8G59/3227C8G59/38C8G59/4021C8G59/5073C8G59/682C8G59/685C9J11/4C9J163/C8K7/6C8K2201/1

Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.

原文(中国語)

Connection resistance can be reduced when an electroconductive composition is used to electrically connect base metals each other or electrically connect a base metal and another material. The connection resistance can be reduced when at least one base metal is used as an object to be electrically connected. An electroconductive composition contains components (A) to (D): a component (A): an epoxy resin; a component (B): a thermally curing agent; a component (C): a nickel powder as an electroconductive powder; and a component (D): an organoaluminum complex.

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