ADHESIVE COMPOSITION, METHOD OF MANUFACTURING ADHESIVE LAYER, AND ELECTRONIC DEVICE
案件概要
発明者
HYUNJUNG LEE; WON-SEOK KIM; KANG-WOO LEE; Dasong LEE
IPC分類
CPC分類
An adhesive composition includes a compound including a repeating unit derived from an acrylate monomer and an additive including a photoinitiator. As a terminal of the compound included in the adhesive composition is cured and a crosslinking structure is formed, volume change of a compound forming an adhesive layer is reduced, thereby preventing bubbles from penetrating into the adhesive layer from outside.
原文（中国語）
An adhesive composition includes a compound including a repeating unit derived from an acrylate monomer and an additive including a photoinitiator. As a terminal of the compound included in the adhesive composition is cured and a crosslinking structure is formed, volume change of a compound forming an adhesive layer is reduced, thereby preventing bubbles from penetrating into the adhesive layer from outside.
外部リソース