METHOD OF TREATING A SHUTTER OF A PVD APPARATUS

原文（中国語）

Method of treating a shutter of a PVD apparatus including providing a PVD apparatus comprising a chamber, a target, a substrate support positioned in the chamber and a shutter which is deployable within the chamber to divide the chamber into a first compartment in which the substrate support is positioned, and a second compartment in which the target is positioned, providing a substrate having a pasting material deposited thereon, the substrate being positioned on the substrate support, deploying the shutter within the chamber to divide the chamber into the first and second compartments. The shutter may have an underside which, in its deployed position, faces the substrate. At least one contaminant material may be present on the underside and generating a plasma in the first compartment to sputter etch pasting material onto the underside of the shutter, thereby pasting the contaminant material to the underside of the shutter.