DEPOSITION QUALITY CONTROL METHOD AND DEPOSITION QUALITY CONTROL SYSTEM PERFORMING THE SAME

原文（中国語）

A deposition quality control method includes: inputting information on a first deposition time, forming a (N−2)encapsulation on a (N−2)substrate and a (N−1)encapsulation on a (N−1)substrate during the first deposition time, measuring a deposition thickness each of a (N−2)encapsulation layer and a (N−1)encapsulation layer, calculating a compensation time which satisfies Equations 1 and 2 below, calculating a second deposition time by adding the compensation time to the first deposition time, and forming a (N)encapsulation layer on a (N)substrate during the second deposition time, Y=AX B+, < ⁢ >Equation where in Equation 1, Y denotes a deposition thickness of the (N)encapsulation layer, A denotes deposition rate, and X denotes the compensation time, B=α*D ( )-α*D+, < ⁢ >Equation where in Equation 2, Ddenotes the thickness of the (N−1)encapsulation layer, Ddenotes the thickness of the (N−2)encapsulation layer, and α denotes a weighted value.