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案件記録

SYSTEM FOR DETECTING SURFACE OF A COATED CONDUCTIVE SUBSTRATE

発明審査中
2閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Andrzej E. Kuczek; Alan C. Barron; Edward Marchitto; Zhigang Wang

IPC分類

G1B 5/12G1B 21/4G5B 19/401

CPC分類

G1B5/12G1B21/47G5B19/401

A system for detecting an edge of a substrate, comprising a coated assembly. The coated assembly includes a conductive substrate having at least one edge portion and a dielectric coating coupled along the conductive substrate, the dielectric coating covering the at least one edge portion of the conductive substrate. The system also includes a conductive tool configured to interact with the coated assembly and a substrate sensing system. The substrate sensing system includes a power source coupled with the conductive tool, the coated assembly, and an electrical circuit including the power source and the coated assembly and a sensor configured to sense a change between an open configuration and a closed configuration of the electrical circuit. In an open configuration the conductive tool is engaged with the coated assembly and disengaged from the conductive substrate and in a closed configuration the conductive tool is engaged with the conductive substrate.

原文(中国語)

A system for detecting an edge of a substrate, comprising a coated assembly. The coated assembly includes a conductive substrate having at least one edge portion and a dielectric coating coupled along the conductive substrate, the dielectric coating covering the at least one edge portion of the conductive substrate. The system also includes a conductive tool configured to interact with the coated assembly and a substrate sensing system. The substrate sensing system includes a power source coupled with the conductive tool, the coated assembly, and an electrical circuit including the power source and the coated assembly and a sensor configured to sense a change between an open configuration and a closed configuration of the electrical circuit. In an open configuration the conductive tool is engaged with the coated assembly and disengaged from the conductive substrate and in a closed configuration the conductive tool is engaged with the conductive substrate.

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