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案件記録
METHODS AND APPARATUSES FOR TESTING MULTI-DIE PACKAGE INTER-CONNECT LINKS
発明審査中
1閲覧数
20請求項 · 3 独立
§ Ⅰ
案件概要
発明者
Rakesh KANDULA; Sriram VENKATESAN; Jeffrey SORIANO; Deep BAROT; Takeshi NAKAZAWA
IPC分類
G1R 31/28
CPC分類
G1R31/2853G1R31/2896
In some embodiments, techniques for testing die to die interconnect links are provided.
原文（中国語）
In some embodiments, techniques for testing die to die interconnect links are provided.
外部リソース