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案件記録

DETECTION OF STRUCTURAL DEFECTS IN AN INTEGRATED CIRCUIT

発明審査中
25請求項 · 3 独立
§ Ⅰ

案件概要

IPC分類

G1R 31/28H1L 23/10

CPC分類

G1R31/2884G1R31/2843H1L23/10

The integrated circuit is equipped with an annular wall including, in a first part, an alternation of conductive stacks containing metal tracks distributed over several metal levels and having an alternately reversed trapezoidal longitudinal section, all these tracks forming together at least one electrically conductive path having at least one staircase portion in a second part of the wall. Defect-detection circuit are located in the integrated circuit and connected to semiconductor zones buried in the substrate under the second part of the wall and connected to the two ends of the at least one electrically conductive path.

原文(中国語)

The integrated circuit is equipped with an annular wall including, in a first part, an alternation of conductive stacks containing metal tracks distributed over several metal levels and having an alternately reversed trapezoidal longitudinal section, all these tracks forming together at least one electrically conductive path having at least one staircase portion in a second part of the wall. Defect-detection circuit are located in the integrated circuit and connected to semiconductor zones buried in the substrate under the second part of the wall and connected to the two ends of the at least one electrically conductive path.

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