WAFER PROBING APPARATUS WITH PROBE CARD POSITIONING MODULE

原文（中国語）

A wafer probing apparatus is provided with a wafer probe station including a wafer chuck and a chuck movement device disposed under the wafer chuck and configured to move the wafer chuck in which a wafer is adhered to the wafer chuck; a lifting mechanism disposed close to the wafer probe station; a support frame provided with the lifting mechanism; at least one probe card positioning module disposed on the support frame, each probe card positioning module including at least one needle alignment device, each needle alignment device having at least one probe card with at least one probe needle; and a mechatronics control system electrically connected to each probe card positioning module. The combination of probe card positioning module and chuck movement device achieves a precise positioning of the probe cards probing on multiple positions of a wafer surface and supports a parallel testing function for higher productivity.