Monitoring and Control of Advance Die-to-Die Interconnect Lanes

原文（中国語）

In the various aspects, the present SoC package uses advanced die-to-die (D2D) interconnects having extra or spare lanes that, when any faulty lane(s) is uncovered during a dynamic HVM health check/testing phase, may be available as a substitute/replacement, or available for load sharing on a rotational basis. The present system and method also provide for an initial HVM health check, i.e., Sort/Class, that will include various tests to determine the working and non-working lanes of the D2D interconnects. In an aspect, when the SoC package is operational, i.e., in functional mode, the extra working lanes are not “fused” by the die-to-die interconnect IP. The present lane controller logic modules may be provided to check and change the lanes dynamically, i.e., as part of the dynamic health check, which can significantly help increase the lifetime of the whole SoC chips/package.