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案件記録

MEMORY DAMAGE DETECTION DURING INTEGRATED CIRCUIT DEVICE BOOT

発明審査中
1閲覧数
20請求項 · 2 独立
§ Ⅰ

案件概要

発明者

Hui Li; Yifan He; Xiong Yan

IPC分類

G1R 31/3187G1R 31/28G6F 21/57

CPC分類

G1R31/3187G1R31/2853G6F21/575

Detecting damage to a memory of an integrated circuit device includes initiating a boot process of the integrated circuit device. The boot process is implemented by a boot processor of the integrated circuit device. As part of the boot process, a die crack test of a memory device of the integrated circuit device is initiated. The memory device is coupled to the boot processor. The boot processor receives a result of the die crack test of the memory device during the boot process. The result of the die crack test is stored in a register of the integrated circuit device.

原文(中国語)

Detecting damage to a memory of an integrated circuit device includes initiating a boot process of the integrated circuit device. The boot process is implemented by a boot processor of the integrated circuit device. As part of the boot process, a die crack test of a memory device of the integrated circuit device is initiated. The memory device is coupled to the boot processor. The boot processor receives a result of the die crack test of the memory device during the boot process. The result of the die crack test is stored in a register of the integrated circuit device.

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