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案件記録

METHOD FOR MANUFACTURING CURED FILM

発明審査中
1閲覧数
20請求項 · 2 独立
§ Ⅰ

案件概要

発明者

Hiroaki Idei; Norifumi Yokoyama

IPC分類

G3F 7/33G3F 7/G3F 7/40

CPC分類

G3F7/33G3F7/7G3F7/40

The present invention provides a method for manufacturing a cured film, in which positioning of a mask during exposure is easily performed and antireflection characteristics of the cured film to be obtained are excellent. The method for manufacturing a cured film of the present invention includes a step 1 of forming a curable composition layer on a support, a step 2 of performing registration between the support and an exposure mask, a step 3 of exposing the curable composition layer through the exposure mask, a step 4 of performing a development treatment on the curable composition layer after the exposure to form a cured film in a patterned shape, and a step 5 of performing a heating treatment on the patterned cured film, in which the curable composition contains a resin A, a resin B, and a polymerizable compound, an HSP distance between the resin A and the resin B is more than 1.5 MPa, and an HSP distance (A) between the resin A and the polymerizable compound is larger than an HSP distance (B) between the resin B and the polymerizable compound.

原文(中国語)

The present invention provides a method for manufacturing a cured film, in which positioning of a mask during exposure is easily performed and antireflection characteristics of the cured film to be obtained are excellent. The method for manufacturing a cured film of the present invention includes a step 1 of forming a curable composition layer on a support, a step 2 of performing registration between the support and an exposure mask, a step 3 of exposing the curable composition layer through the exposure mask, a step 4 of performing a development treatment on the curable composition layer after the exposure to form a cured film in a patterned shape, and a step 5 of performing a heating treatment on the patterned cured film, in which the curable composition contains a resin A, a resin B, and a polymerizable compound, an HSP distance between the resin A and the resin B is more than 1.5 MPa, and an HSP distance (A) between the resin A and the polymerizable compound is larger than an HSP distance (B) between the resin B and the polymerizable compound.

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