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案件記録

DISTRIBUTED TEMPERATURE SENSORS IN A DIE OF A MEMORY DEVICE

発明審査中
2閲覧数
24請求項 · 4 独立
§ Ⅰ

案件概要

発明者

Elena Cabrera Bernal; Fabien Funfrock; Jens Polney; Suhas Shivapakash

IPC分類

G11C 11/406G11C 11/4076G11C 11/4096

CPC分類

G11C11/40626G11C11/4076G11C11/4096

Methods, systems, and devices for distributed temperature sensors in a die of a memory device are described. For example, the distributed temperature sensors may enable a memory system controller to detect hotspots or uneven temperature distributions across the memory system. The memory system controller may perform health monitoring reporting based on the detected hotspots or uneven temperature distributions. In some examples, the memory system controller may activate, or deactivate, one or more components of regions associated with the hotspots to reduce the temperature of the region or die. Additionally, or alternatively, the memory system controller may adjust or retrain a clock signal to compensate for the detected hotspots or uneven temperature distributions.

原文(中国語)

Methods, systems, and devices for distributed temperature sensors in a die of a memory device are described. For example, the distributed temperature sensors may enable a memory system controller to detect hotspots or uneven temperature distributions across the memory system. The memory system controller may perform health monitoring reporting based on the detected hotspots or uneven temperature distributions. In some examples, the memory system controller may activate, or deactivate, one or more components of regions associated with the hotspots to reduce the temperature of the region or die. Additionally, or alternatively, the memory system controller may adjust or retrain a clock signal to compensate for the detected hotspots or uneven temperature distributions.

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