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案件記録

COIL ARRANGEMENT ON A MULTILAYER CIRCUIT BOARD, AND METHOD FOR PRODUCING A COIL ARRANGEMENT

発明審査中
3閲覧数
11請求項 · 2 独立
§ Ⅰ

案件概要

IPC分類

H1F 17/H1F 27/28

CPC分類

H1F17/13H1F27/2804H1F2027/2809

A multilayer circuit board comprising a coil arrangement, the coil arrangement including a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have the same first diameter; and a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have the same second diameter; wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and wherein each turn of the turns of the first coil and the turns of the second coil is formed entirely in a respective single plane.

原文(中国語)

A multilayer circuit board comprising a coil arrangement, the coil arrangement including a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have the same first diameter; and a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have the same second diameter; wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and wherein each turn of the turns of the first coil and the turns of the second coil is formed entirely in a respective single plane.

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