METHODS OF FABRICATING COUPLED COAXIAL INDUCTORS IN PACKAGE STRUCTURES

原文（中国語）

Microelectronic integrated circuit package structures include a package substrate with a core, and an inductor having a length extending vertically through the core. The inductor includes a magnetic material on a sidewall of the core, and a first conductive liner on a sidewall of the magnetic material, where a portion of the first conductive liner that is in a plane orthogonal to the length of the inductor comprises a first opening. A portion of a second conductive liner on the sidewall of the magnetic material that is in the plane comprises a second opening, where the first opening and the second opening face each other and are separated by a distance.