MULTILAYER ELECTRONIC COMPONENT
案件概要
出願人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
発明者
Jun Oh KIM; Byung Kun KIM; Yu Hong OH; Hyun Ji YANG
IPC分類
CPC分類
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.
原文（中国語）
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.
外部リソース