LOW THERMAL BUDGET LASER ANNEALING

原文（中国語）

The embodiments herein provide thermal processing apparatus. The thermal processing apparatus includes a radiation module configured to generate a line of radiation for an annealing process, a substrate support configured to receive a substrate thereon, and a translation mechanism. The substrate support includes one or more channels configured to flow a working fluid therethrough. The working fluid is configured to enable a bottom surface of the substrate disposed upon the substrate support to be cooled to a temperature of about 200° C. to about −200° C. during the annealing process. The translation mechanism is configured to translate the substrate support and the line of radiation relative to one another.