TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
案件概要
出願人
Board of Regents, The University of Texas System; Silicon Metamaterials, Inc.
発明者
Sidlgata V. Sreenivasan; Paras Ajay; Austin Anthis
IPC分類
CPC分類
A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an alignment step.
原文（中国語）
A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an alignment step.
外部リソース