WAFER CHUCKING SYSTEM
案件概要
発明者
Sunghyup KIM; Hyojin KOOK; Mijeong SHIN; Sebin CHOI
IPC分類
CPC分類
A wafer chucking system includes a membrane structure including a first layer having a first coefficient of thermal expansion (CTE) on which a wafer is mountable, and a second layer having a second CTE different from the first CTE, a temperature controller configured to thermally deform the membrane structure by heating or cooling the membrane structure, and an adsorber configured to adsorb the wafer on the membrane structure.
原文（中国語）
A wafer chucking system includes a membrane structure including a first layer having a first coefficient of thermal expansion (CTE) on which a wafer is mountable, and a second layer having a second CTE different from the first CTE, a temperature controller configured to thermally deform the membrane structure by heating or cooling the membrane structure, and an adsorber configured to adsorb the wafer on the membrane structure.
外部リソース