THERMAL-PROCESS APPARATUSES AND METHODS TO REDUCE PROCESS-RELATED THERMAL SHRINKAGE

原文（中国語）

Some embodiments of a thermal module for baking a wafer in a low oxygen environment comprise a hot plate, a movable chamber lid having a recessed region defined by a chamber ceiling and a chamber sidewall for receiving a wafer, and lift pins for raising or lowering the wafer above or onto the hot plate. The recessed region is configured such that, when the wafer is positioned in the recessed region, a narrow gap is formed between the wafer and the recessed region such that a low oxygen environment between the chamber ceiling and a proximal surface of the wafer can be retained.