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案件記録

SUBSTRATE SUPPORT ASSEMBLY AND PLASMA PROCESSING DEVICE

発明審査中
1閲覧数
20請求項 · 1 独立
§ Ⅰ

案件概要

IPC分類

H1L 21/687

CPC分類

H1L21/68785

A substrate support assembly includes a base, a substrate support on the base, and a supply unit. The base includes a first channel and a second channel. The first channel is a channel for a first heat transfer medium. The second channel is a channel for a second heat transfer medium. The supply unit is connected to the second channel. The second channel extends between the first channel and the substrate support. The supply unit is connected to the second channel to supply the second heat transfer medium to the second channel. The second heat transfer medium is a liquid metal.

原文(中国語)

A substrate support assembly includes a base, a substrate support on the base, and a supply unit. The base includes a first channel and a second channel. The first channel is a channel for a first heat transfer medium. The second channel is a channel for a second heat transfer medium. The supply unit is connected to the second channel. The second channel extends between the first channel and the substrate support. The supply unit is connected to the second channel to supply the second heat transfer medium to the second channel. The second heat transfer medium is a liquid metal.

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