DEVICE COMPRISING A PACKAGE, A LID FRAME, A THERMAL INTERFACE MATERIAL AND AN ADHESIVE

原文（中国語）

A device comprising a substrate, a package coupled to the substrate, and a lid frame coupled to the substrate. The package comprises a first integrated device and an encapsulation layer that at least partially encapsulates the first integrated device. The lid frame is further coupled to the first integrated device through a thermal interface material. The lid frame is further coupled to the encapsulation layer through an adhesive.