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案件記録
PACKAGE SUBSTRATES WITH CORES HAVING SOLID GLASS AND GLASS FIBER PREPREG
発明審査中
20請求項 · 3 独立
§ Ⅰ
案件概要
発明者
Brandon Christian Marin; Jeremy D. Ecton; Gang Duan; Srinivas Venkata Ramanuja Pietambaram
IPC分類
H1L 23/8H1L 23/522H1L 23/528
CPC分類
H1L23/8H1L23/5226H1L23/5283
In one embodiment, an apparatus (e.g., a package substrate) includes a core with a layer comprising glass fibers in an epoxy material, a solid glass layer above or on the layer comprising glass fibers in the epoxy material, and a dielectric adjacent the solid glass layer.
原文（中国語）
In one embodiment, an apparatus (e.g., a package substrate) includes a core with a layer comprising glass fibers in an epoxy material, a solid glass layer above or on the layer comprising glass fibers in the epoxy material, and a dielectric adjacent the solid glass layer.
外部リソース