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案件記録

TOOLING HOLE FOR HYBRID PANEL ASSEMBLY

発明審査中
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Brandon C. MARIN; Jeremy D. ECTON; Gang DUAN; Srinivas Venkata Ramanuja PIETAMBARAM

IPC分類

H1L 23/15H1L 23/538H1L 23/58

CPC分類

H1L23/15H1L23/5384H1L23/585H10D1/20

Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer. In an embodiment, a first cavity is formed through a thickness of the substrate from a first surface of the substrate to a second surface of the substrate, and a second cavity is formed through the thickness of the substrate. In an embodiment, a layer is over the substrate, where the layer at least partially fills the first cavity and the second cavity. In an embodiment, a plug is within the first cavity, where a first portion of the layer separates the plug from the substrate. In an embodiment, a component is in the second cavity, where a second portion of the layer separates the component from the substrate.

原文(中国語)

Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer. In an embodiment, a first cavity is formed through a thickness of the substrate from a first surface of the substrate to a second surface of the substrate, and a second cavity is formed through the thickness of the substrate. In an embodiment, a layer is over the substrate, where the layer at least partially fills the first cavity and the second cavity. In an embodiment, a plug is within the first cavity, where a first portion of the layer separates the plug from the substrate. In an embodiment, a component is in the second cavity, where a second portion of the layer separates the component from the substrate.

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