TOOLING HOLE FOR HYBRID PANEL ASSEMBLY
案件概要
発明者
Brandon C. MARIN; Jeremy D. ECTON; Gang DUAN; Srinivas Venkata Ramanuja PIETAMBARAM
IPC分類
CPC分類
Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer. In an embodiment, a first cavity is formed through a thickness of the substrate from a first surface of the substrate to a second surface of the substrate, and a second cavity is formed through the thickness of the substrate. In an embodiment, a layer is over the substrate, where the layer at least partially fills the first cavity and the second cavity. In an embodiment, a plug is within the first cavity, where a first portion of the layer separates the plug from the substrate. In an embodiment, a component is in the second cavity, where a second portion of the layer separates the component from the substrate.
原文(中国語)
Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer. In an embodiment, a first cavity is formed through a thickness of the substrate from a first surface of the substrate to a second surface of the substrate, and a second cavity is formed through the thickness of the substrate. In an embodiment, a layer is over the substrate, where the layer at least partially fills the first cavity and the second cavity. In an embodiment, a plug is within the first cavity, where a first portion of the layer separates the plug from the substrate. In an embodiment, a component is in the second cavity, where a second portion of the layer separates the component from the substrate.
外部リソース