Microelectronic Glass-Containing Core Layer Including Clamp Structure

原文（中国語）

A core layer of a package substrate includes a dielectric layer; a glass sheet encapsulated in the dielectric layer; and a clamp structure including a through-via extending through the sheet, a top plate structure connected to a top end of the through-via, and a bottom plate structure connected to a bottom end of the through-via, wherein one of: the top plate structure and the bottom plate structure have respective lateral end surfaces that are substantially flush with a lateral edge surface of the core layer; or the through-via is a first through-via, the core layer includes a block at an edge region thereof that defines an interface with the dielectric layer and includes an organic material, the clamp structure includes a second through-via extending through the block, the top plate structure is connected to top ends of respective ones of the first through-via and the second through-via, and the bottom plate structure is connected to bottom ends of respective ones of the first through-via and the second through-via.