SEMICONDUCTOR PACKAGE HAVING A THREE-DIMENSIONAL PRINTED ENCLOSURE
案件概要
発明者
MUHAMAD RIDHWAN HAFIZ BIN ROSDI; MUHAMMAD FAIZUL MOHD YUNUS; CINDIRELLA QUINIT NOROMOR; HUBERT TOLENTINO HELERA; THINES RAVENDRAN
IPC分類
CPC分類
A semiconductor package includes a number of electronic components surrounded or enclosed by a 3D printed enclosure. The 3D printed enclosure is formed by a 3D printing process that uses a thermosetting liquid resin as a molding compound. The 3D printing process includes immersing the electronic components in the thermosetting liquid resin. When the electronic components have been immersed in the thermosetting liquid resin, one or more light sources are selectively activated to cure the thermosetting liquid resin which forms the enclosure. In addition to forming the enclosure, the thermosetting liquid resin and the curing process is also used to form various markings on the enclosure.
原文（中国語）
A semiconductor package includes a number of electronic components surrounded or enclosed by a 3D printed enclosure. The 3D printed enclosure is formed by a 3D printing process that uses a thermosetting liquid resin as a molding compound. The 3D printing process includes immersing the electronic components in the thermosetting liquid resin. When the electronic components have been immersed in the thermosetting liquid resin, one or more light sources are selectively activated to cure the thermosetting liquid resin which forms the enclosure. In addition to forming the enclosure, the thermosetting liquid resin and the curing process is also used to form various markings on the enclosure.
外部リソース