HEAT SPREADERS THAT INCLUDE THERMAL DISSIPATION REGIONS COMPRISING DIAMOND
案件概要
発明者
Je-Young CHANG; Aastha UPPAL; Aravindha ANTONISWAMY
IPC分類
CPC分類
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.
原文（中国語）
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.
外部リソース