HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES

原文（中国語）

Semiconductor structures are provided in which heat spreading and thermal heat removal are improved by providing one or more heat removal paths in which heat spreading and thermal heat removal occurs leveraging horizontal direction and vertical directions and through reduced resistance of heat removal paths. Notably, heat is spread horizontally to the edges of the semiconductor structures and then the heat is removed vertically (up and/or down) from the semiconductor structures.