BACKSIDE POWER DELIVERY NETWORK HEAT DISSIPATION
案件概要
出願人
International Business Machines Corporation
発明者
HUIMEI ZHOU; Oleg Gluschenkov; Ruilong Xie
IPC分類
CPC分類
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.
原文（中国語）
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.
外部リソース