SEMICONDUCTOR PACKAGE WITH HOTSPOT CONTROL
案件概要
出願人
Taiwan Semiconductor Manufacturing Company, LTD.
発明者
Sheng-Han Tsai; Wensen Hung; Wei-Kong Sheng; Tsung-Yu Chen; Yen-Pu Chen
IPC分類
CPC分類
A semiconductor package includes one or more semiconductor dies, and a lid disposed on the one or more semiconductor dies. One or more thermoelectric coolers are disposed on or in the lid. Each thermoelectric cooler is positioned at a predetermined hotspot of the one or more semiconductor dies. In one method of operating such a semiconductor package, functions are run on one or more semiconductor dies of the semiconductor package. During the running of these functions, one or more predetermined hotspots of the one or more semiconductor dies are cooled by operating a thermoelectric cooler positioned at each respective predetermined hotspot.
原文（中国語）
A semiconductor package includes one or more semiconductor dies, and a lid disposed on the one or more semiconductor dies. One or more thermoelectric coolers are disposed on or in the lid. Each thermoelectric cooler is positioned at a predetermined hotspot of the one or more semiconductor dies. In one method of operating such a semiconductor package, functions are run on one or more semiconductor dies of the semiconductor package. During the running of these functions, one or more predetermined hotspots of the one or more semiconductor dies are cooled by operating a thermoelectric cooler positioned at each respective predetermined hotspot.
外部リソース