SEMICONDUCTOR PACKAGING SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

原文（中国語）

A semiconductor packaging substrate structure is provided and includes a circuit build-up structure and at least one winding spiral coil. The circuit build-up structure has at least one first patterned wiring layer, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The winding spiral coil is composed of an enameled wire. The first patterned wiring layer is embedded in the third dielectric layer. The winding spiral coil is embedded in the second dielectric layer. The first patterned wiring layer and the winding spiral coil are electrically connected to each other. A manufacturing method of the semiconductor packaging substrate structure is further provided.