SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
案件概要
出願人
Amkor Technology Singapore Holding Pte. Ltd.
発明者
Keun Soo Kim; Jae Yun Kim; Byoung Jun Ahn; Dong Soo Ryu; Dae Byoung Kang; Chel Woo Park
IPC分類
CPC分類
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
原文（中国語）
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
外部リソース