MODULARIZED CONSTRUCT FOR COMPLEX CHIPLET INTEGRATION PACKAGE

原文（中国語）

Modularized construction of a structure is used for a multi-die integration package. Segregation of complex devices into substructures (sub-modules) are tested and verified as functional before final reconstitution into the multi-die integration package. The thermal coefficient of sub-modules can be fine-tuned for low chip module warpage. The sub-modules can be made with a glass interposer tuned with a certain coefficient of thermal expansion (CTE) and modulus to provide favorable warpage performance. Solder interconnects at high stress locations may be used to further reduce via and polyimide (PI) stresses. A minimal redistributed layer (RDL) comprising conductive metal patterns with a plurality of metal contacts thereon is formed on a polyimide (PI) or glass carrier and electrically interconnects the sub-modules together.