INTEGRATED DIE CIRCUIT

原文（中国語）

An integrated circuit (IC) die configured for packaging in a plurality of different IC packages, the IC die comprising: a first set of die contacts positioned in a first region of the integrated circuit die; a second set of die contacts positioned in a second region of the integrated circuit die; a package type contact; and routing circuitry configured to selectively route signals to or from either the first set of die contacts or the second set of die contacts based on a package type signal received at the package type contact.