STRUCTURES WITH ENHANCED THERMAL HEAT SPREADING AND REMOVAL
案件概要
出願人
International Business Machines Corporation
発明者
John Knickerbocker; John W Golz; Keiji Matsumoto; Mukta Ghate Farooq
IPC分類
CPC分類
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.
原文（中国語）
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.
外部リソース