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案件記録

DEVICE COMPRISING A METALLIC WIRE AND FABRICATION PROCESS OF THE DEVICE

発明審査中
4閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Hugo NUEZ; Frederic BATTEGAY; Pierre TISSIER; Philippe BRUN

IPC分類

H1L 23/532H1L 21/768

CPC分類

H1L23/53238H1L21/76841H1L23/53266

A device comprising a first layer, a trench partially running through the first layer extending from a first side, and being filled with a conductive etch stop layer, a conductive barrier layer covering the conductive etch stop layer, and a track of a first metallic material in contact with the barrier layer, in the trench, an opening in the first layer extending from a second side, opposite to the first side, of the dielectric or semiconductor layer, the opening running through the first layer all the way to the etch stop layer, and a first layer of a second metallic material covering the walls of the opening.

原文(中国語)

A device comprising a first layer, a trench partially running through the first layer extending from a first side, and being filled with a conductive etch stop layer, a conductive barrier layer covering the conductive etch stop layer, and a track of a first metallic material in contact with the barrier layer, in the trench, an opening in the first layer extending from a second side, opposite to the first side, of the dielectric or semiconductor layer, the opening running through the first layer all the way to the etch stop layer, and a first layer of a second metallic material covering the walls of the opening.

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