PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
案件概要
出願人
Taiwan Semiconductor Manufacturing Company, Ltd.
発明者
Hung-En HSU; Ping-Tai CHEN; Ming-Wei PENG; Kuo-Ching HSU
IPC分類
CPC分類
A method for fabricating a package structure is provided. The method includes forming a first patterned photoresist layer over a first surface of a substrate. The method includes forming a plurality of first connector structures in openings of the first patterned photoresist layer. The method includes removing the first patterned photoresist layer. The method includes forming a solder mask layer over the first connector structures. The method includes performing a surface treatment process to the first connector structures. The method also includes bonding a package component to the substrate via the first connector structures.
原文（中国語）
A method for fabricating a package structure is provided. The method includes forming a first patterned photoresist layer over a first surface of a substrate. The method includes forming a plurality of first connector structures in openings of the first patterned photoresist layer. The method includes removing the first patterned photoresist layer. The method includes forming a solder mask layer over the first connector structures. The method includes performing a surface treatment process to the first connector structures. The method also includes bonding a package component to the substrate via the first connector structures.
外部リソース