PACKAGE STRUCTURE WITH ELECTROMAGNETIC SHIELDING FUNCTIONALITY
案件概要
発明者
Xianfang YANG; Peng LI; Junjun LI; Yuhao LIU
IPC分類
CPC分類
A package structure with electromagnetic shielding functionality includes: a substrate; a chip, disposed on a surface of the substrate; a conductive dam, disposed on the surface of the substrate and grounded, the conductive dam surrounding a periphery of the chip; a plurality of wires, disposed on the conductive dam; a molding body, covering the surface of the substrate and encapsulating the chip, the conductive dam, and the wires, wherein a portion of each of the wires is exposed on a surface of the molding body; and a conductive layer, positioned outside the molding body and at least corresponding to the chip, wherein the conductive layer is electrically connected to the wires, and the conductive layer, the wires, and the conductive dam together form a Faraday cage surrounding the chip.
原文（中国語）
A package structure with electromagnetic shielding functionality includes: a substrate; a chip, disposed on a surface of the substrate; a conductive dam, disposed on the surface of the substrate and grounded, the conductive dam surrounding a periphery of the chip; a plurality of wires, disposed on the conductive dam; a molding body, covering the surface of the substrate and encapsulating the chip, the conductive dam, and the wires, wherein a portion of each of the wires is exposed on a surface of the molding body; and a conductive layer, positioned outside the molding body and at least corresponding to the chip, wherein the conductive layer is electrically connected to the wires, and the conductive layer, the wires, and the conductive dam together form a Faraday cage surrounding the chip.
外部リソース