LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES
案件概要
発明者
Tarek GEBRAEL; Mohamed ELHEBEARY; Darshan RAVOORI; Matthew T. MAGNAVITA; Xiao LU
IPC分類
CPC分類
Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.
原文（中国語）
Semiconductor device assemblies that comprise a package substrate having semiconductor devices on two sides. A solder layer can thermally couple one or more semiconductor devices on a side of the package with a circuit board. Methods of manufacturing assemblies having a semiconductor device thermally coupled to a circuit board are also provided.
外部リソース